Abis Circuits Co., Ltd.
Abis Circuits Co., Ltd One stop PCB solution, we fight for our customers success! We labor for simplicity!
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HDI PCB Introduction:
HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than employed in conventional PCB technology. HDI PCBs are made through micro vias, buried vias, and sequential lamination with insulation materials and conductor wiring for a higher density of routing.
HDI PCB is used to reduce size and weight, as well as to enhance the electrical performance of the device. HDI PCB is the best alternative to high-layer-count and expensive standard laminate or sequentially laminated boards. HDI incorporate blind and buried vias that help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today's fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.
Where does the resin material come from in ABIS?
Most of them are from Shengyi Technology Co., Ltd. (SYTECH), who has been the world's second-largest CCL manufacturer in terms of sales volume, from 2013 to 2017. We established long-term relations of cooperation since 2006. The FR4 resin material (Model S1000-2, S1141, S1165, S1600) are mainly used for making single and double-sided printed circuit boards as well as multi-layer boards. Here comes details for your reference.
Rigid PCB Manufacturing Capacity
ABIS experienced in making special materials for rigid PCB, such as: CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc. Below is a brief overview FYI.