Abis Circuits Co., Ltd.

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1.6mm FR4 CEM1 Multilayer Printed Circuit Board Service Electronic Board Green Soldermask With Immersion Gold

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Abis Circuits Co., Ltd.
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsWendy
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1.6mm FR4 CEM1 Multilayer Printed Circuit Board Service Electronic Board Green Soldermask With Immersion Gold

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Brand Name :Abis
Model Number :Multilayer PCB
Certification :ISO14001, ISO9001, UL, cUL, TS16949
Place of Origin :Made in China
MOQ :1
Price :Customized
Payment Terms :T/T, Western Union, paypal ect.
Supply Ability :60,000sqm per month
Delivery Time :7-15 working days
Packaging Details :vacuum package
Product name :Rigid Multilayer printed circuit board
Base material :FR4
Copper :1oz/35um
PCB Thickness :1.6mm
Surface finishing :Immersion Gold,HASL,ENIG,Gold plating,HASL Lead Free,OSP
Solder mask :Green
Silkscreen :White
Min. line width :0.075mm/3mil
Min. hole size :0.15mm
Application :Electronics Device,Consumer Electronics,Communications,and so on
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1.6mm FR4 CEM1 Multilayer Printed Circuit Board Service Electronic Board Green Soldermask With Immersion Gold

Abis Circuits Co. Ltd, established in 2006, Located in Shenzhen, our company has about 1100 workers and two PCB workshops with about 50000 square meters.

Our products are mostly used in the field of Industrial Control, Telecommunication, Automotive products, Medical, Consumer, Security, and others.

Our perfect management, advanced equipment, and professional staffs are the keys for us to fight to win more market shares with other competitors. Customer satisfaction and support are what we have been strived for.

Our Mission:


PCBs for demanding customers, on time with zero defects, produced sustainably at the lowest total cost. Manufacturing many different types of PCBs in smaller series (High-mix, Low-volume) involves constantly adjusting, adapting and problem solving.

Product details:

1. Single, Double side & Multi-layer PCB.

2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole.

3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable mask,

4. Printed Circuit Boards adhere to IPC Class 2 & 3 international PCB standard.

5. Quantities range from prototype to medium&big batch production.

6.100% E-Test.

Product Description

No. of Layers 1-20
Max. Board Size 860*610mm
Board Thickness 0.2-6.0mm
Copper Thickness 0.5OZ-6OZ
Material Various
Surface Finish Various
Soldermask Various
Minimum Soldermask Thickness 0.025mm
Minimun Soldermask BridgeDam 0.15mm
Minimum Soldermask Clearance 0.075mm
Peelable Colours Blue
Peelable Minimum Feature 0.5mm
Peelable Maximum Tented Hole 3.0mm
Scoring Angle 30 Degrees
Min. Remaining Thickness 0.3mm
Min. Distance to copper (From center of scoring line) 0.5mm
Min. Track 0.1mm
Min.Gap(TrackTrack,TrackPad,PadPad) 0.1mm
NPTH Min. Drill Size 0.2mm
Plated Drill Size ± 0.075mm
Non-Plated Drill Size ± 0.05mm
Drill Location Tolerance ± 0.05mm
OutlineRouted Slots ± 0.1mm
Line Width/Spacing ±10%
Board Thickness ±10%
Warp and Twist 0.05%
Scoring/V-Cut ± 5 degrees
Scoring Positional Tolerance ± 0.1mm
Aspect Ratio 10:01

Lead Time

Category Q/T Lead time Standard Lead Time Mass Production
2 Layers 24hrs 3-4 working days 8-15 working days
4 Layers 48hrs 3-5 working days 10-15 working days
6 Layers 72hrs 3-6 working days 10-15 working days
8 Layers 96hrs 3-7 working days 14-18 working days
10 Layers 120hrs 3-8 working days 14-18 working days
12 Layers 120hrs 3-9 working days 20-26 working days
14 Layers 144hrs 3-10 working days 20-26 working days
16-20 Layers Depends on the specific requirements
20+ Layers Depends on the specific requirements

Multilayer PCB Production Range

Number of layers 4 – 22 layers standard, 30 layers advanced
Technology highlights Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
HDI builds 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D
Materials FR4 standard, FR4 high performance, Halogen free FR4, Rogers
Copper weights (finished) 18μm – 70μm
Minimum track and gap 0.075mm / 0.075mm
PCB thickness 0.40mm – 3.20mm
Maxmimum dimensions 610mm x 450mm; dependant upon laser drilling machine
Surface finishes available OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
Minimum mechanical drill 0.15mm
Minimum laser drill 0.10mm standard, 0.075mm advanced

Testing

E-testing 100%
QFP Pitch 16mil (0.40mm)
BGA Pitch 16mil (0.40mm)
Connector Pitch 16mil (0.40mm)

AOI All Multilayer
Impedance Control ± 10%
Solderability Testing As standard
Ionic Contamination On Request

PCB Process

1.6mm FR4 CEM1 Multilayer Printed Circuit Board Service Electronic Board Green Soldermask With Immersion Gold

FAQ

Q1: How can I get a quotation?
. Please send gerber file with format: .PCB / .P-CAD / .DXP / .Gerber

Q2: Can you manufacture my PCBs from a picture file?
. Could you please provide a sample?

Q3: Do you have PCB in stock?
. Most of our PCB board are customized, which according to Gerber file.
. ABIS has samples in stock that could be sent to you for quality checking always.


Q4: What board manufacturer do you use for FR4?
. Main Suppliers(FR4): Kingboard (Hong Kong), NanYa (Taiwan), and Shengyi (China).

Q5: Will my PCB files be checked?
. Checked within 12 hours. Once Engineer's question and working file be approved, production will start.

Q6: What do you require in order to produce an assembly quotation?
. Bill of materials (BOM) detailing:
a), manufacturers parts numbers,
b), components suppliers' parts number (e.g. Digi-key, Mouser, RS )
c), PCBA sample photos if possible.
d), Quantity

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